SURFACE MOUNT PROCESS
  • Home
  • Articles
    • A GUIDE TO EFFECTIVE STENCIL DESIGN
    • SOLDER PASTE PRINTING PROCESS
    • SOLDER PASTE INSPECTION PROCESS
    • COMPONENT PLACEMENT PROCESS
    • REFLOW SOLDERING PROCESS
    • POST-REFLOW AOI PROCESS
    • THROUGH-HOLE ASSEMBLY - SELECTIVE SOLDERING
    • Cleaning 'No-Clean' flux residues and other contaminants
    • Environmental Protection - Conformal Coating
    • Hand soldering and rework of surface mount components to IPC class 3
  • FAQ
    • Solder paste handling
    • Type 3 or Type 4 Solder Paste
    • Cleaning a misprinted PCB
    • Solder Paste Quality Control
    • What factors affect solder paste transfer efficiency
    • What stencil thickness should be used?
    • What is the difference between aspect ratio and area ratio of stencil apertures?
    • What squeegee speed should be used?
    • What squeegee pressure should be used?
    • What the differences between 'on-contact' printing and 'gap' printing?
    • What separation speed to use in solder paste printing?
    • What are the benefits / challenges of using halogen-free solder paste?
    • What is the best stencil aperture shape for solder paste transfer efficiency?
    • PCB delamination during reflow
    • What are the different types of reflow profile?
    • ROSE (Resistivity of Solvent Extract) testing
    • How do you validate a PCBA cleaning process?
    • Why clean a pcba that has been soldered using no-clean flux
    • How do engineered cleaning fluids such as Zestron and Kyzen work
    • How do engineered cleaning fluids affect surface tension and wetting angle?
    • How does the pH level affect engineered cleaning fluids?
    • How do mixed-bed and carbon filters work in PCB cleaning systems?
    • What are the risks of using ultrasonics to clean PCBA's?
    • What are the differences between 'Water-soluble' and 'No-clean' flux?
    • What is the difference between ionic and non-ionic contamination?
    • What causes electrochemical migration (ECM)?
    • What are methods of masking before conformal coating?
    • How to apply conformal coating by brushing?
    • How to apply conformal coating using dipping?
    • How to apply conformal coating using spray/aerosol?
    • How do selective robots apply conformal coating?
    • What is the best method to dry/cure conformal coating?
    • What concerns are there when demasking?
    • What should be checked when inspecting after conformal coating?
    • How to check the adhesion of conformal coating?
    • Tape and Reel Packaging Standards
    • What is 'Package on Package' (POP)?
    • Stock control and component attrition
    • BOM Comparison Software
    • Comparison of SAC305 and SAC387 Lead-Free Solder Alloys
    • What is a 'Eutectic' solder alloy?
    • What does 'SMT' stand for?
    • What does the term voiding mean?
    • How is void percentage calculated?
    • How to reduce voids in QFN device ground connection?
    • Low temperature lead free solder paste
    • CAD EXTRACTION
    • How are PCB's manufactured?
    • What are the IPC standards that govern electronics manufacturing processes?
    • What are the differences between SMEMA and HERMES?
  • Contact

Why clean a pcba that has been soldered using no-clean flux?

Picture
Cleaning PCBA (Printed Circuit Board Assemblies) that have been soldered using no-clean flux is a decision that depends on specific factors and application requirements. While no-clean fluxes are formulated to leave behind residues that are non-corrosive and non-conductive, there are situations where cleaning may still be necessary or beneficial:

Reliability and Longevity: Even though no-clean flux residues are generally designed to be stable and reliable, some applications, especially those with stringent reliability requirements (e.g., aerospace, medical devices, automotive), may demand the utmost cleanliness to ensure long-term performance and avoid potential issues related to corrosion or electrical leakage.

Surface Quality: In some cases, the visual appearance of a PCB is critical, and the presence of flux residues can affect the board's aesthetics. For consumer electronics or products with transparent or exposed PCBs, cleanliness is a concern.

Compatibility: When conformal coatings, potting compounds, or other post-assembly treatments are applied to the PCB, ensuring a clean surface can be crucial for proper adhesion and effectiveness. Residues left by no-clean flux may interfere with these processes.

Component Sensitivity: Certain sensitive electronic components, such as microelectronic devices, sensors, or precision resistors, may be negatively impacted by the presence of even minimal flux residues. Cleaning can be essential to ensure the proper functioning of these components.

Environmental Considerations: Environmental regulations and industry standards may require the removal of certain contaminants, including flux residues, to meet specific cleanliness and environmental requirements.

Custom Requirements: Some customers or industries may have custom specifications or cleanliness standards that necessitate cleaning, regardless of the type of flux used.

It's important to note that if you decide to clean PCBA assemblies soldered with no-clean flux, you should follow best practices to ensure the cleaning process is conducted correctly. This includes using the appropriate cleaning chemistry, equipment, and processes to remove flux residues without damaging the components or the PCB. Additionally, thorough rinsing and drying are essential to prevent residue buildup and potential long-term issues.

Before deciding to clean, it's advisable to consider the specific requirements of your application, industry standards, and the recommendations of the PCB and flux manufacturers. Additionally, conducting reliability testing or compatibility assessments with the chosen cleaning process is a good practice to ensure that the cleaning does not negatively impact the performance or longevity of the PCBAs.
© COPYRIGHT 2015. ALL RIGHTS RESERVED.