SURFACE MOUNT PROCESS
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    • THROUGH-HOLE ASSEMBLY - SELECTIVE SOLDERING
    • Cleaning 'No-Clean' flux residues and other contaminants
    • Environmental Protection - Conformal Coating
    • Hand soldering and rework of surface mount components to IPC class 3
  • FAQ
    • Solder paste handling
    • Type 3 or Type 4 Solder Paste
    • Cleaning a misprinted PCB
    • Solder Paste Quality Control
    • What factors affect solder paste transfer efficiency
    • What stencil thickness should be used?
    • What is the difference between aspect ratio and area ratio of stencil apertures?
    • What squeegee speed should be used?
    • What squeegee pressure should be used?
    • What the differences between 'on-contact' printing and 'gap' printing?
    • What separation speed to use in solder paste printing?
    • What are the benefits / challenges of using halogen-free solder paste?
    • What is the best stencil aperture shape for solder paste transfer efficiency?
    • PCB delamination during reflow
    • What are the different types of reflow profile?
    • ROSE (Resistivity of Solvent Extract) testing
    • How do you validate a PCBA cleaning process?
    • Why clean a pcba that has been soldered using no-clean flux
    • How do engineered cleaning fluids such as Zestron and Kyzen work
    • How do engineered cleaning fluids affect surface tension and wetting angle?
    • How does the pH level affect engineered cleaning fluids?
    • How do mixed-bed and carbon filters work in PCB cleaning systems?
    • What are the risks of using ultrasonics to clean PCBA's?
    • What are the differences between 'Water-soluble' and 'No-clean' flux?
    • What is the difference between ionic and non-ionic contamination?
    • What causes electrochemical migration (ECM)?
    • What are methods of masking before conformal coating?
    • How to apply conformal coating by brushing?
    • How to apply conformal coating using dipping?
    • How to apply conformal coating using spray/aerosol?
    • How do selective robots apply conformal coating?
    • What is the best method to dry/cure conformal coating?
    • What concerns are there when demasking?
    • What should be checked when inspecting after conformal coating?
    • How to check the adhesion of conformal coating?
    • Tape and Reel Packaging Standards
    • What is 'Package on Package' (POP)?
    • Stock control and component attrition
    • BOM Comparison Software
    • Comparison of SAC305 and SAC387 Lead-Free Solder Alloys
    • What is a 'Eutectic' solder alloy?
    • What does 'SMT' stand for?
    • What does the term voiding mean?
    • How is void percentage calculated?
    • How to reduce voids in QFN device ground connection?
    • Low temperature lead free solder paste
    • CAD EXTRACTION
    • How are PCB's manufactured?
    • What are the IPC standards that govern electronics manufacturing processes?
    • What are the differences between SMEMA and HERMES?
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How do engineered cleaning fluids such as Zestron and Kyzen work?

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Both Zestron and Kyzen are global suppliers of engineered cleaning fluids for removing flux residues from electronic assemblies. Aqueous cleaning fluids are concentrated fluid compositions that rapidly dissolve, and in some cases saponify the flux residue.  PCBA cleaning machines provide dynamic forces that allow the cleaning material to penetrate, dissolve the flux residue and remove from the surface and under low-standoff components.

Aqueous cleaning fluids are built with four driving forces: 1. Dissolution, 2. Saponification, 3. Wetting, 4. Minor ingredients to address foaming and compatibility. Aqueous cleaning has been more challenging as electronic assemblies move toward increasingly dense circuit designs, populated with low-standoff components, and the move toward Pb-free. To address these challenges, both Zestron and Kyzen works closely with customers, solder material companies, and cleaning equipment companies to design cleaning fluids that address customer needs.
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