SURFACE MOUNT PROCESS
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  • FAQ
    • Solder paste handling
    • Type 3 or Type 4 Solder Paste
    • Cleaning a misprinted PCB
    • Solder Paste Quality Control
    • What factors affect solder paste transfer efficiency
    • What stencil thickness should be used?
    • What is the difference between aspect ratio and area ratio of stencil apertures?
    • What squeegee speed should be used?
    • What squeegee pressure should be used?
    • What the differences between 'on-contact' printing and 'gap' printing?
    • What separation speed to use in solder paste printing?
    • What are the benefits / challenges of using halogen-free solder paste?
    • What is the best stencil aperture shape for solder paste transfer efficiency?
    • PCB delamination during reflow
    • What are the different types of reflow profile?
    • ROSE (Resistivity of Solvent Extract) testing
    • How do you validate a PCBA cleaning process?
    • Why clean a pcba that has been soldered using no-clean flux
    • How do engineered cleaning fluids such as Zestron and Kyzen work
    • How do engineered cleaning fluids affect surface tension and wetting angle?
    • How does the pH level affect engineered cleaning fluids?
    • How do mixed-bed and carbon filters work in PCB cleaning systems?
    • What are the risks of using ultrasonics to clean PCBA's?
    • What are the differences between 'Water-soluble' and 'No-clean' flux?
    • What is the difference between ionic and non-ionic contamination?
    • What causes electrochemical migration (ECM)?
    • What are methods of masking before conformal coating?
    • How to apply conformal coating by brushing?
    • How to apply conformal coating using dipping?
    • How to apply conformal coating using spray/aerosol?
    • How do selective robots apply conformal coating?
    • What is the best method to dry/cure conformal coating?
    • What concerns are there when demasking?
    • What should be checked when inspecting after conformal coating?
    • How to check the adhesion of conformal coating?
    • Tape and Reel Packaging Standards
    • What is 'Package on Package' (POP)?
    • Stock control and component attrition
    • BOM Comparison Software
    • Comparison of SAC305 and SAC387 Lead-Free Solder Alloys
    • What is a 'Eutectic' solder alloy?
    • What does 'SMT' stand for?
    • What does the term voiding mean?
    • How is void percentage calculated?
    • How to reduce voids in QFN device ground connection?
    • Low temperature lead free solder paste
    • CAD EXTRACTION
    • How are PCB's manufactured?
    • What are the IPC standards that govern electronics manufacturing processes?
    • What are the differences between SMEMA and HERMES?
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Water

The water molecule, H2O, is composed of two hydrogen atoms and one oxygen atom. Diagrams
depicting the H2O molecule can be seen below.
Picture
The H2O molecule is asymmetrical. The angle the O—H bonds make with each other is 104.5°.  This means that because of the distribution of electrons around each atomic nucleus, the H2O molecule is polar, meaning it has a partial negative electronic charge in the vicinity of the exposed part of the oxygen atom, and a partial positive charge in the vicinity of the hydrogen atoms, see diagram (c). This drives physical and chemical activity of the water molecule.

Water exists in three physical states, solid, liquid, and vapor. Liquid water boils at or above 100°C (212°F), and eventually boils away entirely to the vapor phase. Liquid water freezes at or below 0°C (32°F) forming solid ice.

The overall gas composition contained within a perfectly sealed enclosure, as an enclosed system, which has no leaks and cannot exchange gas with the external environment, can contain water in any of the three physical states.

The state or states that may be present inside the enclosure are a function of the overall pressure of the contained gas, the number (concentration) of water molecules present in that gas, and the system temperature.

In the vapor phase H2O molecules “float” and move around freely in the space available. Molecular motion is a function of temperature. The higher the temperature, the further and faster molecules move around. In the liquid phase, as temperatures decline, H2O molecules become “condensed” together in much more dense concentrations. In that state molecules still move around, but much more slowly, while the overall physical state remains liquid. In the solid state as ice, or frost,molecular motion still occurs but is more restricted than even in the liquid state.

Dewpoint temperature determines the change of state between water being present as a vapor or as a liquid (condensate). Whether water molecules exist as liquid or vapor is a function of concentration of molecules and temperature. Generally, as temperature declines, the more molecules condense out as liquid. A nomograph defining dewpoint temperatures as a function of water vapor concentration is on p. 4. To use it, position a ruler on the pressure value on the right hand scale (at 14.7psi for typical 1 atmosphere conditions), position it at whatever the moisture concentration is known to be on the left-hand scale, and where it crosses dewpoint on the middle scale tells the temperature at or below where dew, frost, or liquid condensate will form. Conversely, if positioned at a dewpoint temperature, it will tell how much water vapor can be present before dew, frost, or liquid condensate forms.

Within the enclosed system, water molecules can be present not only as vapor, liquid, or ice, but as kind of intermediate entity in the form of adsorbate. In this form, individual “layers” of molecules can adhere to surfaces without forming discrete liquid condensate. Whether adsorbates form are a function of the surface condition of exposed substrate. Surface energy, texture, and chemical composition of the substrate surface can either attract or repel a layer or layers of adsorbate from its surroundings. The polarity of water molecules (mentioned above), with partial electrical charge distribution around the molecule, is also a factor in adsorbate formation.

Three or more monolayers of water molecules adhering to a surface, and bridging functional electrical structures, is the threshold condition for surface electrical conduction, which can lead to parametric instability of electronic devices or, depending on surface chemistry, could initiate material corrosion.

Water as liquid condensate on any surface is potentially chemically corrosive. If that occurs on an electrically conductive structure of an electronic device, the conductor may eventually lose enough material to chemical modification or complete removal as to form an electrical open, causing device failure. A contributing factor to this is not only presence of liquid condensate, but also surface cleanliness. Residual water soluble ionic contaminants, especially halide ions like chloride or alkali ions like sodium and potassium, can accelerate these kind of failure-causing reactions because of their tendency to form chemically corrosive solutions or increase the electrical conductivity of liquid condensate.

Within small enclosed microelectronic systems containing integrated circuits, MEMs devices, or optical components, to insure functional reliability and extended device lifetimes, it is essential that water vapor concentration be kept to a minimum. This is why military and aerospace specifications, e.g. Mil-Std 883, include Test Method 1018-10 “Internal Gas Analysis” for analyzing internal gas composition of hermetic devices. The maximum criterion for water vapor allowed by TM 1018 is 5,000 parts per million by volume (0.5 volume percent). It is also why Nasa invokes ASTM Method 595E “Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment” to qualify such products for space applications.

These particular test methods would not directly apply for larger electronic systems (vehicles, etc.). But the principles and needs for both moisture control and ionic cleanliness are exactly the same.
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