SURFACE MOUNT PROCESS
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    • A GUIDE TO EFFECTIVE STENCIL DESIGN
    • SOLDER PASTE PRINTING PROCESS
    • SOLDER PASTE INSPECTION PROCESS
    • COMPONENT PLACEMENT PROCESS
    • REFLOW SOLDERING PROCESS
    • POST-REFLOW AOI PROCESS
    • THROUGH-HOLE ASSEMBLY - SELECTIVE SOLDERING
    • Cleaning 'No-Clean' flux residues and other contaminants
    • Environmental Protection - Conformal Coating
    • Hand soldering and rework of surface mount components to IPC class 3
  • PROCESS IMPROVEMENT
    • DESIGN FOR MANUFACTURE AND ASSEMBLY
  • FAQ
    • SMD Component Packages
    • Solder paste handling
    • Type 3 or Type 4 Solder Paste
    • Cleaning a misprinted PCB
    • Solder Paste Quality Control
    • What factors affect solder paste transfer efficiency
    • What stencil thickness should be used?
    • What is the difference between aspect ratio and area ratio of stencil apertures?
    • What squeegee speed should be used?
    • What squeegee pressure should be used?
    • What the differences between 'on-contact' printing and 'gap' printing?
    • What separation speed to use in solder paste printing?
    • What are the benefits / challenges of using halogen-free solder paste?
    • What is the best stencil aperture shape for solder paste transfer efficiency?
    • PCB delamination during reflow
    • What are the different types of reflow profile?
    • ROSE (Resistivity of Solvent Extract) testing
    • How do you validate a PCBA cleaning process?
    • Why clean a pcba that has been soldered using no-clean flux
    • How do engineered cleaning fluids such as Zestron and Kyzen work
    • How do engineered cleaning fluids affect surface tension and wetting angle?
    • How does the pH level affect engineered cleaning fluids?
    • How do mixed-bed and carbon filters work in PCB cleaning systems?
    • What are the risks of using ultrasonics to clean PCBA's?
    • What are the differences between 'Water-soluble' and 'No-clean' flux?
    • What is the difference between ionic and non-ionic contamination?
    • What causes electrochemical migration (ECM)?
    • What are methods of masking before conformal coating?
    • How to apply conformal coating by brushing?
    • How to apply conformal coating using dipping?
    • How to apply conformal coating using spray/aerosol?
    • How do selective robots apply conformal coating?
    • What is the best method to dry/cure conformal coating?
    • What concerns are there when demasking?
    • What should be checked when inspecting after conformal coating?
    • How to check the adhesion of conformal coating?
    • Tape and Reel Packaging Standards
    • What is 'Package on Package' (POP)?
    • Stock control and component attrition
    • BOM Comparison Software
    • Comparison of SAC305 and SAC387 Lead-Free Solder Alloys
    • What is a 'Eutectic' solder alloy?
    • What does 'SMT' stand for?
    • What does the term voiding mean?
    • How is void percentage calculated?
    • How to reduce voids in QFN device ground connection?
    • Low temperature lead free solder paste
    • CAD EXTRACTION
    • How are PCB's manufactured?
    • What are the IPC standards that govern electronics manufacturing processes?
    • What are the differences between SMEMA and HERMES?
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Loose Component Feeder Trays

A smarter way to feed loose components without buying full reels or expensive feeders

VIEW AVAILABLE SIZES AND ORDER

LOOSE COMPONENT FEEDER TRAYS FOR PICK AND PLACE SURFACE MOUNT ASSEMBLY

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Increase efficiency of expensive pick and place equipment
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Quick changeovers - Higher utilisation & less downtime
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Organised - 5S compliant compact storage unit
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Compatible with a wide range of pick and place machines

One of the many challenges Contract Electronics Manufacturers (CEMs) face in surface mount assembly is receiving components loose in bags instead of in tape.

This usually happens with prototype and small-batch production, where only a limited number of components are needed. Buying in tape is often prohibitively expensive and leaves many parts unused.

At the same time, feeders are costly and take up valuable machine space, making them impractical for this type of work.

This can lead to parts being manually placed by line operators, causing quality concerns and reduced process efficiency.


INTRODUCING LOOSE COMPONENT FEEDER TRAYS

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8-16 POCKET LOOSE COMPONENT FEEDER TRAY (TOP)
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8-16 POCKET LOOSE COMPONENT FEEDER TRAY (BTM)
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16-32 POCKET LOOSE COMPONENT FEEDER TRAY (TOP)
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16-32 POCKET LOOSE COMPONENT FEEDER TRAY (BTM)
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32-64 POCKET LOOSE COMPONENT FEEDER TRAY (TOP)
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32-64 POCKET LOOSE COMPONENT FEEDER TRAY (BTM)
VIEW FULL TRAY SPECIFICATION
Our Loose Component Feeder Trays let you load these loose components easily onto your pick-and-place machine, enabling components to be placed automatically instead of by hand.

The trays are double-sided, enabling different-sized components to be loaded.

The trays can be placed together and taught as one due to the pitch between pockets being the same between trays as within one tray.

Loading is quick and simple: just place the loose parts into the pockets in the tray offline.

To maximise machine utilisation, multiple trays can be preloaded offline and swapped in seconds, keeping the production line running.

Trays are made from ESD-safe material to avoid damage to sensitive electronic components.

IDEAL FOR:-

  • Contract Electronic Manufacturers (CEMs)
  • High-Mix, Low-Volume
  • New Product Introduction (NPI)
  • Prototype Builds
  • Short Production Runs
CONTACT THE TEAM WITH ANY QUESTIONS
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Free Tray Holder with your first order

Order any number of Loose Component Feeder Trays and get a professional 12-Tray Holder (worth £99) free of charge!


BUY IN STORE
Have questions? - Email us at [email protected]