SURFACE MOUNT PROCESS
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  • Articles
    • A GUIDE TO EFFECTIVE STENCIL DESIGN
    • SOLDER PASTE PRINTING PROCESS
    • SOLDER PASTE INSPECTION PROCESS
    • COMPONENT PLACEMENT PROCESS
    • REFLOW SOLDERING PROCESS
    • POST-REFLOW AOI PROCESS
    • THROUGH-HOLE ASSEMBLY - SELECTIVE SOLDERING
    • Cleaning 'No-Clean' flux residues and other contaminants
    • Environmental Protection - Conformal Coating
    • Hand soldering and rework of surface mount components to IPC class 3
  • FAQ
    • Solder paste handling
    • Type 3 or Type 4 Solder Paste
    • Cleaning a misprinted PCB
    • Solder Paste Quality Control
    • What factors affect solder paste transfer efficiency
    • What stencil thickness should be used?
    • What is the difference between aspect ratio and area ratio of stencil apertures?
    • What squeegee speed should be used?
    • What squeegee pressure should be used?
    • What the differences between 'on-contact' printing and 'gap' printing?
    • What separation speed to use in solder paste printing?
    • What are the benefits / challenges of using halogen-free solder paste?
    • What is the best stencil aperture shape for solder paste transfer efficiency?
    • PCB delamination during reflow
    • What are the different types of reflow profile?
    • ROSE (Resistivity of Solvent Extract) testing
    • How do you validate a PCBA cleaning process?
    • Why clean a pcba that has been soldered using no-clean flux
    • How do engineered cleaning fluids such as Zestron and Kyzen work
    • How do engineered cleaning fluids affect surface tension and wetting angle?
    • How does the pH level affect engineered cleaning fluids?
    • How do mixed-bed and carbon filters work in PCB cleaning systems?
    • What are the risks of using ultrasonics to clean PCBA's?
    • What are the differences between 'Water-soluble' and 'No-clean' flux?
    • What is the difference between ionic and non-ionic contamination?
    • What causes electrochemical migration (ECM)?
    • What are methods of masking before conformal coating?
    • How to apply conformal coating by brushing?
    • How to apply conformal coating using dipping?
    • How to apply conformal coating using spray/aerosol?
    • How do selective robots apply conformal coating?
    • What is the best method to dry/cure conformal coating?
    • What concerns are there when demasking?
    • What should be checked when inspecting after conformal coating?
    • How to check the adhesion of conformal coating?
    • Tape and Reel Packaging Standards
    • What is 'Package on Package' (POP)?
    • Stock control and component attrition
    • BOM Comparison Software
    • Comparison of SAC305 and SAC387 Lead-Free Solder Alloys
    • What is a 'Eutectic' solder alloy?
    • What does 'SMT' stand for?
    • What does the term voiding mean?
    • How is void percentage calculated?
    • How to reduce voids in QFN device ground connection?
    • Low temperature lead free solder paste
    • CAD EXTRACTION
    • How are PCB's manufactured?
    • What are the IPC standards that govern electronics manufacturing processes?
    • What are the differences between SMEMA and HERMES?
  • Contact

3D PRINTING SERVICE

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Welcome to our new 3D Printing Services! At Surface Mount Process, we've expanded our expertise in electronics manufacturing to include high-quality, custom 3D printing solutions. Whether you're prototyping, producing small batches, or need specialized tools, our 3D printing service delivers precision and reliability tailored to your needs.

Discover Our Flagship Product: Custom 3D Printed Component Placement Trays

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Are you tired of disorganized component handling during SMT assembly? Our 3D Printed Component Placement Trays are designed to streamline your workflow, reduce errors, and boost efficiency. Engineered specifically for electronics professionals, these trays offer a customizable solution for organizing surface mount components like resistors, capacitors, and ICs.

Why Choose Our 3D Printed Trays?

  • Enhanced Assembly Quality: Parts are securely loaded into the trays and automatically placed by the machine, eliminating hand placement errors for consistent, high-quality assemblies.
  • Boosted Machine Efficiency: No delays waiting for loose parts to be hand-fitted—streamline your workflow with seamless machine operation.
  • Static-Safe Design: Crafted from ESD-safe material, ensuring complete protection against static discharge for sensitive components.
  • Nesting Innovation: Tray design allows multiple trays to be loaded with the same components and taught as a single unit during machine pickup, simplifying setup and scaling.
  • Double-Sided Versatility: Each tray features two sides with different pocket sizes, accommodating a wider range of components in one convenient tool.
  • Durable Materials: Made from high-quality filaments that withstand workshop environments, ensuring longevity and reusability.
  • Precision Fit: With tolerances as tight as 0.1mm, your components are positioned accurately awaiting pickup and placement, minimizing pick errors and vision rejects.

Imagine a workspace where efficiency and precision define every assembly—our trays make it possible!

Real Results from Satisfied Customers

"These trays have revolutionized our SMT setup! No more hunting for tiny components—everything is right where it needs to be." — John D., Electronics Engineer at Tech Innovations

"Custom nesting trays saved us hours in setup. High quality, fast turnaround—highly recommend for any electronics setup." — Mia K., Manufacturing Lead at CircuitPro

Take the Next Step Today

Ready to optimize your SMT process? Let's get you started:

  1. Explore Samples: Order a standard double-sided tray for a trial run at a special intro price.
  2. Get a Custom Quote: Share your requirements for a free, personalized estimate.
  3. Contact Our Team: Have questions? Email us at [email protected].
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