SURFACE MOUNT PROCESS
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  • FAQ
    • Solder paste handling
    • Type 3 or Type 4 Solder Paste
    • Cleaning a misprinted PCB
    • What factors affect solder paste transfer efficiency
    • PCB support during assembly
    • Component weight limit
    • PCB delamination during reflow
    • Moisture Sensitivity Level
    • Preferred PCB surface finish
    • BOM Comparison Software
    • What does 'SMT' stand for?
    • What does the term voiding mean?
    • Low temperature lead free solder paste
    • 8 Wastes of Lean Manufacturing
    • What software is available to view Gerber data?
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    • SURFACE MOUNT TROUBLESHOOTING GUIDE
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Surface Mount Process was created a number of years ago to be a location to store information relating to different aspects of the surface mount assembly process.

It wasn’t expected to attract the amount of attention that it has from people all around the world.

We’re currently expanding the services offered from not only process information and Centroid File Generation but also to include Design for Manufacture and Assembly feedback and Tooling Design and Manufacture.

If you would like to advertise on our website please let us know either by using our contact page or email - surfacemountprocess@gmail.com

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